Magnetic Sensing Based Wireless Connection Technology for 3D-ICs
碩士 === 國立清華大學 === 電子工程研究所 === 101 === Currently, 3D integrated circuits have received widespread interests, since this technology has the potential to break through the limits of traditional 2-D circuits. TSV is main stream technology since it gives rise to the high packing density and operates unde...
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| Format: | Others |
| Language: | zh-TW |
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2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43269302219729597549 |