| Summary: | 碩士 === 國立清華大學 === 電子工程研究所 === 101 === Currently, 3D integrated circuits have received widespread interests, since this technology has the potential to break through the limits of traditional 2-D circuits. TSV is main stream technology since it gives rise to the high packing density and operates under low power. However, the fabrication process of TSV requires the formation of bumps and high aspect ratio structure, leading to higher cost and reliability issues. Contactless 3D IC connection, including inductive and capacitive coupling links, becomes more promising, due to its better yield and lower cost.
In this paper, a new concept of contactless 3D connection interface through magnetic field modulation is firstly reported. This data transmission module uses a micro-coil as magnetic field generator and using a MTJ structure as magnetic field sensor. Magnetic spin is high sensitive device consider to be very fast and without memory characteristic. This 3D IC technology opportunity to achieve a low cost and wide bandwidth scheme by implementing CMOS compatible MTJ as receiver, CMOS compatible micro-coil as transmitter.
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