3D Redundancy Architecture for Wide-I/O DRAM
碩士 === 國立清華大學 === 電機工程學系 === 101 === The three-dimensional integrated circuit (3D IC) is considered a promising approach that can obtain high data band-width and low power consumption for future electronic systems that require high integration level. One of the popular drivers for 3D IC is the integ...
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| Format: | Others |
| Language: | en_US |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97903502792722541857 |