Novel Metallization Technology development Study
碩士 === 國立臺灣師範大學 === 光電科技研究所 === 101 === In this study, we investigated the silver metallization technology and feasibility of Ti-based diffusion barrier for Back-Eend-of-Line (BEOL) interconnect application. A single ALD-TiN film with bi-functional diffusion barrier and plating seed layer was devel...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91889058132785314137 |