Development of anodic bonding technique and application under atmosphere pressure plasma
碩士 === 國立臺灣師範大學 === 機電科技學系 === 101 === Although the conventional anodic bonding technique, compared with another bonding techniques, has been widely used in micro-electro-mechanical system (MEMS) package, for the benefits of non-intermediate, tight binding, and simple process. However, its heating m...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/58781123609849660788 |