Analysis of interfacial reaction during the formation of Pb-free solder joint
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 101 === This research analyzed the interface of solder joint during the soldering process. It separated into four parts. Part I focused on early melting of the solder joint. The dominant mechanism for the growth of Cu6Sn5 and Cu3Sn at the early stage was investiga...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72797021008479385612 |