Extraction and Compensation of Through Silicon Vias in 3D-IC
碩士 === 國立臺灣大學 === 電信工程學研究所 === 101 === Optimizing the performance of integrated circuits (IC) in a limited space has become an important issue as electronic devices continue to decrease in size. One of the most promising technologies that aim to solve this issue is called three dimensional integrate...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/14238549692905549305 |