The KSF analysis on the integrated stack package of 3D-IC chip-An empirical study of company S
碩士 === 國立臺灣科技大學 === 管理研究所 === 101 === This study analyzes competitive strategy and opportunity of company S and future application of Taiwan’s integrated stack package of 3D-IC chip to investigate the technical development of 3D-IC chip in the integration of package and testing of semiconductor indu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53807980508571013379 |