The KSF analysis on the integrated stack package of 3D-IC chip-An empirical study of company S

• Main Authors: Hua-Yi Lin, 林逸華
• Other Authors: Shun-Chiao Chang
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/53807980508571013379

碩士 === 國立臺灣科技大學 === 管理研究所 === 101 === This study analyzes competitive strategy and opportunity of company S and future application of Taiwan’s integrated stack package of 3D-IC chip to investigate the technical development of 3D-IC chip in the integration of package and testing of semiconductor industries using a strategic case study. The technical development of 3D-IC chip, after a rapid boost during 2004 to 2010, grows up quickly for requirement from the market. The strategic trend of economies of scale in package industries has transferred into competition of service and integrated techniques. The case study verifies the way to understand the feature of technical development in the integrated stack package of 3D-IC chip and users’ expectation for the case company to find out key factor of transforming capability, as well as retain and expand market share among package subcontractors. As for the future technical development of the integrated stack package of 3D-IC chip, this study concludes the future strategy and implement for company S as follows: 1. Real time on-line customer service and responsive technical support; 2. Even more rapid and effective whole technical support service; 3. More complete application of integrated products and cooperative customer service items. Concerning the technical development of case company in the integrated stack package of 3D-IC chip, this study demonstrates suggestions as follows: 1. Integrated modular for packaging specification of customer electronics; 2. Aggressive seizing and entering automotive supply chain; 3. Actively expand the field of customized service and become a high level of technical package subcontractor. Regarding the growth and future technical development of the integrated stack package of 3D-IC chip, this study clarifies the integrated stack package of 3D-IC chip is going to be the principal axis of electronic related products and customer electronics. As a result, company S has to understand its own technical capability and expectation from the market so as to sustain the leadership and velocity of enterprise growth, when implementing competitive strategy.