Cladding Stress Engineering Study on Silicon Wire

碩士 === 國立臺灣科技大學 === 電子工程系 === 101 === In recent years, the multifunction from miniature silicon photonic and its CMOS compatible fabrication have gradually attracted a lot of attentions. To avoid the optical interconnection, the integrated photonic devices composed of different material layers becom...

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Bibliographic Details
Main Authors: Sheng-Min Wang, 王勝民
Other Authors: Shih-Hsiang Hsu
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/46323087426019356684