A Study of Detecting Defection within IC Package Structure by Ultrasonic Testing
碩士 === 國立虎尾科技大學 === 材料科學與綠色能源工程研究所 === 101 === In this study, straight beam immersion type of ultrasonic detector was used to detect the structural defect(s) inside IC package, where the reflected wave and overlapping effects were discussed through the echo signal ratio in front of and back of the t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52pwam |