The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique
碩士 === 國立虎尾科技大學 === 電子工程系碩士班 === 101 === In this study, the films are proposed that can be apply for low-temperature flip chip package by transient liquid phase bonding as AlGeSn-base. The AlGe/Sn films are deposited by thermal evaporation. And then the sample is placed in the vacuum environment for...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/em95pz |