The Cost-Benefit Analysis of Copper Wire Bonding Process in IC Package
碩士 === 國立臺北科技大學 === 管理學院工業工程與管理EMBA專班 === 101 === As technology continues to progress and products revolutionize, the requirements to consuming electronic products also increase. In order to meet consumer demand, chip design companies toward a more powerful, less power consumption, smaller chip and...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4arsej |