Study on the Warpage of Notebook Screen Cover by Using Mold Flow Analysis
碩士 === 國立臺北科技大學 === 製造科技研究所 === 101 === In this thesis, Mold Flow analysis software was used to study the warpage and deformation of notebook screen cover. First, the noise experiments proceed by using Taguchi method and L8 orthogonal array to find the significant factor. Second, apply L18 inner...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/nz3849 |