| Summary: | 碩士 === 國立臺北科技大學 === 製造科技研究所 === 101 === In this thesis, Mold Flow analysis software was used to study the warpage and deformation of notebook screen cover. First, the noise experiments proceed by using Taguchi method and L8 orthogonal array to find the significant factor. Second, apply L18 inner orthogonal array and L4 outer orthogonal array to find out the optimal injection molding parameters.
Through quality characteristics, S/N ratio and variation analysis, results show the significant factors include the gate location, packing pressure, melt temperature and flow rate. Using of the optimal parameters, the warpage was improved in compared with the original parameters by CAE analysis. By using of the optimal parameters in the actual injection molding products, the warpage in Y-axis direction is also better than original ones. The experiment of confirmation showed that the confidence interval of predicted value and the experiment of confirmation is close. Under 95% confidence level the simulation results are accurate reliable.
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