Study on the Performance of Thin Vapor Chamber in Different Vapor Flow Space and Wick Modification

碩士 === 國立臺北科技大學 === 製造科技研究所 === 101 === 3C products have been designed toward thinner and tiny scale as a result of attracting more attention of consumers. Thus, the improved efficiency of heat dissipation for electronic devices is a difficult challenge. Vapor chamber is one kind of cooling system...

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Bibliographic Details
Main Authors: Tz-Ming Huang, 黃子明
Other Authors: Cherng-Yuh Su
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/btkw8r