Effects of Active Elements on Transient Liguid Phase Bonding
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 101 === In this study, copper/copper and nickel/nickel transient liquid phase bonding with Sn-3Ag-0.5Cu lead-free solder and Sn-3Ag-0.5Cu-4Ti-0.1Mm active solder containing active elements were investigated. After aging test at 250℃, the solders and base metals were...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20348086495636982073 |