Interfacial reaction and mechanical properties between Sn-Ag-Cu alloy and submicron Ni(P) metallization pads
碩士 === 元智大學 === 化學工程與材料科學學系 === 101 === Recently, thin Ni(P) films (less than 1 μm in thickness) have received significant attention from the electronic industry because they offer greater bondability with Cu wires and less magnetic effect than do thick Ni(P). However, submicron Ni(P) films are app...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/92896982361389308716 |