A study on the growth behavior and microstructure of the electroplating Cu in the through hole structure
碩士 === 元智大學 === 化學工程與材料科學學系 === 101 === Abstract Department of Chemical Engineering and Materials Science College of Engineering Yuan Ze University Through hole (TH) filling technology has become a critical process for fabricating high density interconnection (HDI) circuit boards. In this study, the...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/06086513636924986550 |