Application of pH-Sensitive Catalyst Ink on Electroless Copper Plating
碩士 === 國防大學理工學院 === 化學工程碩士班 === 102 === In this study, a pH-responsive palladium catalyst for electroless copper deposition was prepared. The noble metal nanoparticles reduced and stabilized by styrene monomer and 2-(N,N-dimethylamino)-ethyl methacrylate(DMAEMA) monomer by free radical polymerizati...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73586523938153974567 |