電子封裝銲錫球接點之高速剪力衝擊實驗的發展與分析
博士 === 國立中正大學 === 機械工程學系暨研究所 === 102 === One of the important issues of a lead-free solder joint package is to design proper layers of structure and adjust manufacturing parameters so that the electric performance and the strength of the solder joint could reach the design requirements. The mechanic...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91642876901165532248 |