電子封裝銲錫球接點之高速剪力衝擊實驗的發展與分析
博士 === 國立中正大學 === 機械工程學系暨研究所 === 102 === One of the important issues of a lead-free solder joint package is to design proper layers of structure and adjust manufacturing parameters so that the electric performance and the strength of the solder joint could reach the design requirements. The mechanic...
Main Authors: | Hsu, Chang-Lin, 許彰麟 |
---|---|
Other Authors: | Liu, De-Shin |
Format: | Others |
Language: | zh-TW |
Published: |
2014
|
Online Access: | http://ndltd.ncl.edu.tw/handle/91642876901165532248 |
Similar Items
-
Sn-3.5Ag銲錫球格陣列構裝接點之高溫機械性質分析
by: J. T. Chiang, et al.
Published: (2003) -
塑封球柵陣列電子構裝之濕熱應力分析
by: 蒙彥良
Published: (1998) -
Sn-In-Ag無鉛銲錫球格陣列構裝破損分析
by: 陳俊宏
Published: (2004) -
含裂縫塑封球柵陣列電子構裝之熱應力分析
by: 廖學國
Published: (1998) -
LED封裝產業發展分析-以台灣一LED封裝廠為例
by: 劉偉凱, et al.