The Study of Warpage Simulation of Wafer Processing
碩士 === 中華大學 === 機械工程學系碩士班 === 102 === Electronic Packaging reliability is of great concern to semiconductor and electronic product manufacturers. From the first to the fourth generation computer, the tremendous growth of computers and 3C products, and its significant impact on our lives is the inven...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04876770022028255303 |