The Study of Thermal Behavior of 2.5D Package with Embedded Interposer
碩士 === 中華大學 === 機械工程學系碩士班 === 102 === Under the demand of 3C consumer market, electronic devices are expected to be lighter, thinner, smaller with more functions and higher performance in near future. In order to match this goal, it is necessary to add-on more functions into one single chip and this...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18815982994918315290 |