Sn-(Ag)-(Cu)/Fe Interfacial Reactions and Phase Equilibria of the Sn-Ag-Fe Ternary System
碩士 === 中原大學 === 化學工程研究所 === 102 === Fe is the common material of lead frame (Fe-42wt%Ni) alloys and Kovar alloy (Fe-Co-Ni alloy). In recent years, Fe has been evaluated in wafer level chip size package (Wafer Level Chip Scale Package, WLCSP).Sn-3.5wt%Ag is the widely used lead-free solder in indus...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04694506526110980622 |