Improving and review the System in Package technology- antenna design take example via
碩士 === 健行科技大學 === 電子工程系碩士班 === 102 === Nowadays electronic products to slim and light as its main appeal, electronic products to achieve compact size currently SoC (System on chip) and SiP (System in Package) solutions, changes in market applications very frequently, carry terms of SoC digital, anal...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/48kyxv |