Improving and review the System in Package technology- antenna design take example via

• Main Authors: Hao-liang Liao, 廖浩良
• Other Authors: Yuh-Sien Sun
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/48kyxv

碩士 === 健行科技大學 === 電子工程系碩士班 === 102 === Nowadays electronic products to slim and light as its main appeal, electronic products to achieve compact size currently SoC (System on chip) and SiP (System in Package) solutions, changes in market applications very frequently, carry terms of SoC digital, analog, and RF integrated circuit design, it is very drawn out waste time. Therefore, the current mainstream IC packages for 3D stacked SiP is a different process and die for wire bonding provisioning packages to quickly enter the market for research on issues related SiP package is quite important. On the SiP packaging related issues, generally there are resistors, inductors, capacitors, crystal bare wire cabling, thermal design, the system changes the frequency transceiver processing, broadband antenna design, reduce interference, topics, integrated package of various scholars in SiP views integration and improve the design of coping is an issue of urgent treatment study. This article in the consolidated whole SiP limited space, various scholars in the passive components (resistors, inductors, capacitors, wire cabling) for best production and provisioning wire bonding technology to offset the associated parasitic resistance, reactance, capacitance and crosstalk impact. Also in the package SiP design suitable heat also to integrate the use of copper as a heat dissipation area and the connecting plate is connected to the BGA type layer structure in the manner drilling yielded better cooling effect. In this paper, the design community in response to changes in the system often needs to send and receive frequencies, can be used for SiP packaging proposed antenna matching architecture, this new architecture enables SiP changes in the frequency transceiver, without changes to the original SiP design. Especially suitable for SiP in frequency (UHF) and very high frequency (EHF) broadband antenna design also proposes two antenna structure can be applied to 2G and 3G communications and 60GHz band (bandwidth up to 13.5GHz) use.