The Application of Multi-Sided Pyramid Encapsulation on LED Packaging Module
碩士 === 逢甲大學 === 自動控制工程學系 === 102 === This study presents a micro fabrication with high efficiency. By using the processes of bulk micromachining, wafers bonding and photoresist spin coating and heating the encapsulated air., we propose a LED light module with large viewing angle and light uniformity...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/14649552380631181636 |