Laser-induced wet cleaning technique for wafers and glass
碩士 === 華梵大學 === 機電工程學系 === 102 === The aimed of this paper is to propose an alternative technique of laser cleaning for silicon wafer and glass substrates. The substrate is obliquely inserted into water. The substrate surface and the direction of the laser beam are intersected with an inclined angle...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35534702885625364165 |