A Study on technology of metalization of high heat dispersion Al2O3 substrate
碩士 === 崑山科技大學 === 機械工程研究所 === 102 === In this project the directly bonding copper (DBC) technology will be used to metalized Al2O3 ceramic substrate. A solid-state reaction method will be used to grow a thin layer of cuprous oxide (Cu2O) on the surface of Cu foil by covered with a layer of copper ox...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68489670701493603489 |