Applying RFID to the SECS/GEM automatic wafer coating system.

碩士 === 國立高雄應用科技大學 === 電子工程系碩士班 === 102 === The yield Improvement, sufficient throughput, and quality guarantee are the main aspects to enhance the competition ability of a company. These issues can be attained by the automation of production line. The ultimate target is the production system aut...

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Main Authors: Tzu-Kun Hung, 洪慈堃
Other Authors: Hung-Yu Wang
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/16109480998523970729
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spelling ndltd-TW-102KUAS03930252016-05-22T04:34:20Z http://ndltd.ncl.edu.tw/handle/16109480998523970729 Applying RFID to the SECS/GEM automatic wafer coating system. 應用RFID技術於SECS/GEM自動晶圓塗佈系統 Tzu-Kun Hung 洪慈堃 碩士 國立高雄應用科技大學 電子工程系碩士班 102 The yield Improvement, sufficient throughput, and quality guarantee are the main aspects to enhance the competition ability of a company. These issues can be attained by the automation of production line. The ultimate target is the production system automation with minimum human supervision. One of the limitations of production line automation is the incompatible communication interfaces between machines from the same or different companies. To solve this problem, Semiconductor Equipment and Materials International (SEMI) announce the equipment communication standard SECS in 1980. The wafer coating process is a very important stage within the semiconductor production. The operation of some equipment in present factory is manual so it introduces several human errors. In this thesis, following SECS/GEM standard, we have developed the controlled codes for automatic wafer coating system. By applying radio frequency identification (RFID) technology to products recognition, the host machine can remotely control and communicate with the equipment for wafer coating operation. The function includes wafer lot number identification, wafer counting, and operation sequence arrangement. It shows that the human error has been reduced massively by using the proposed approach. Hung-Yu Wang Ping-Shou Cheng 王鴻猷 鄭平守 2014 學位論文 ; thesis 66 zh-TW
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language zh-TW
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description 碩士 === 國立高雄應用科技大學 === 電子工程系碩士班 === 102 === The yield Improvement, sufficient throughput, and quality guarantee are the main aspects to enhance the competition ability of a company. These issues can be attained by the automation of production line. The ultimate target is the production system automation with minimum human supervision. One of the limitations of production line automation is the incompatible communication interfaces between machines from the same or different companies. To solve this problem, Semiconductor Equipment and Materials International (SEMI) announce the equipment communication standard SECS in 1980. The wafer coating process is a very important stage within the semiconductor production. The operation of some equipment in present factory is manual so it introduces several human errors. In this thesis, following SECS/GEM standard, we have developed the controlled codes for automatic wafer coating system. By applying radio frequency identification (RFID) technology to products recognition, the host machine can remotely control and communicate with the equipment for wafer coating operation. The function includes wafer lot number identification, wafer counting, and operation sequence arrangement. It shows that the human error has been reduced massively by using the proposed approach.
author2 Hung-Yu Wang
author_facet Hung-Yu Wang
Tzu-Kun Hung
洪慈堃
author Tzu-Kun Hung
洪慈堃
spellingShingle Tzu-Kun Hung
洪慈堃
Applying RFID to the SECS/GEM automatic wafer coating system.
author_sort Tzu-Kun Hung
title Applying RFID to the SECS/GEM automatic wafer coating system.
title_short Applying RFID to the SECS/GEM automatic wafer coating system.
title_full Applying RFID to the SECS/GEM automatic wafer coating system.
title_fullStr Applying RFID to the SECS/GEM automatic wafer coating system.
title_full_unstemmed Applying RFID to the SECS/GEM automatic wafer coating system.
title_sort applying rfid to the secs/gem automatic wafer coating system.
publishDate 2014
url http://ndltd.ncl.edu.tw/handle/16109480998523970729
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AT hóngcíkūn yīngyòngrfidjìshùyúsecsgemzìdòngjīngyuántúbùxìtǒng
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