Robust Resign and Process Optimization For QFN Package Sawing
碩士 === 國立高雄應用科技大學 === 工業工程與管理系碩士在職專班 === 102 === In recent years, the electronic products changed so fast, and Taiwan suffer the tough competition with Korea in the semi-conduct industry. Nowadays, the consumer IC are getting thinner, and getting higher technique. Therefore, we must upgrade the IC...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65tk99 |