An Improvement Study on Wafer Backside Lamination Bump Damage
碩士 === 國立高雄應用科技大學 === 模具系碩士在職專班 === 102 === "Wafer backside lamination" is one of the selection process during WLCSP (wafer level packaging process), which is not necessary. It can be chosen by the customer. BSL plays an important role in protecting and reinforcing the strength of the back...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47034991587037594750 |