Application of Six Sigma techniques to improve the efficiency of wafer process to take tablets

碩士 === 明志科技大學 === 工業工程與管理研究所 === 103 === This research focused on the efficiency improvement of wafer take out from production line to do further analysis procedure. The delay ratio reaches to 50% for each case from wafer taken out to the final report come out. Base on current procedure it will caus...

Full description

Bibliographic Details
Main Authors: Chih Hui Lin, 林芝慧
Other Authors: Kuentai Chen
Format: Others
Language:zh-TW
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/99228196572917396133