Study of Metallization on Glass and Ceramic Substrates
博士 === 國立中興大學 === 化學工程學系所 === 102 === Recently, three-dimensional (3D) chip stacking has been paid significant attention. Interposer is a key connection component for the chip stacking, which serves as a bridge to connect multiple devices in z-direction. Glass has some significant advantages, such a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/40575617155574188680 |