Adhesion Effects of EMC on Mirror and Matted Mold Surfaces during IC Packaging Process
碩士 === 國立成功大學 === 工程科學系 === 102 === In the IC packaging industry, epoxy molding compound (EMC) in the curing process covers electronic chips. It causes the adhesion phenomenon on the surface of packaging mold called adhesion effects. Adhesion effects influence the entire process in production line....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37032341640560805319 |