Interfacial reactions and phase equilibria between indium thermal interface material and Cu and Ni substrates
碩士 === 國立成功大學 === 材料科學及工程學系 === 102 === With many advantages, pure indium is usually used as Thermal interfacial materials (TIMs) to applied to minimize the contact thermal resistances. Copper and nickel are commonly used in electronics. As a result, the Cu/In/Ni sandwich structure is an essential c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/vu8b89 |