Interfacial reactions and phase equilibria between indium thermal interface material and Cu and Ni substrates
碩士 === 國立成功大學 === 材料科學及工程學系 === 102 === With many advantages, pure indium is usually used as Thermal interfacial materials (TIMs) to applied to minimize the contact thermal resistances. Copper and nickel are commonly used in electronics. As a result, the Cu/In/Ni sandwich structure is an essential c...
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ndltd-TW-102NCKU51590172019-05-15T21:42:45Z http://ndltd.ncl.edu.tw/handle/vu8b89 Interfacial reactions and phase equilibria between indium thermal interface material and Cu and Ni substrates 銦基界面散熱材料與銅、鎳基材之界面反應與相平衡 Yu-hsiangWang 王郁翔 碩士 國立成功大學 材料科學及工程學系 102 With many advantages, pure indium is usually used as Thermal interfacial materials (TIMs) to applied to minimize the contact thermal resistances. Copper and nickel are commonly used in electronics. As a result, the Cu/In/Ni sandwich structure is an essential component in the heat dissipation system. In this study, three different sandwich-type diffusion couples, namely Cu/In/Cu, Ni/In/Ni, and Cu/In/Ni, were annealed at 280 °C and 360 °C for various lengths of time. The IMCs were then identified with the corresponding phase diagrams. For the asymmetric Cu/In/Ni couples, a porous layer with tiny grains and special rod-like grains Cu11In9 were formed at the Cu/In interface; however, a thin planar Ni3In7 and discontinuous bulky Cu11In9 grains were found at the In/Ni interface. The microstructural evolution and the mechanism of phase transformations are discussed in this paper. Furthermore, a tentative Cu-In-Ni ternary phase diagram is proposed to elucidate the progression of Cu/In/Ni interfacial reactions. In addition, series of ternary Cu-In-Ni alloys were designed, fabricated, and heat-treated at 360 °C. And a new ternary compound was found in the Cu-In-Ni 360 oC isothermal section. Shih-Kang Lin 林士剛 2014 學位論文 ; thesis 129 zh-TW |
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碩士 === 國立成功大學 === 材料科學及工程學系 === 102 === With many advantages, pure indium is usually used as Thermal interfacial materials (TIMs) to applied to minimize the contact thermal resistances. Copper and nickel are commonly used in electronics. As a result, the Cu/In/Ni sandwich structure is an essential component in the heat dissipation system. In this study, three different sandwich-type diffusion couples, namely Cu/In/Cu, Ni/In/Ni, and Cu/In/Ni, were annealed at 280 °C and 360 °C for various lengths of time. The IMCs were then identified with the corresponding phase diagrams. For the asymmetric Cu/In/Ni couples, a porous layer with tiny grains and special rod-like grains Cu11In9 were formed at the Cu/In interface; however, a thin planar Ni3In7 and discontinuous bulky Cu11In9 grains were found at the In/Ni interface. The microstructural evolution and the mechanism of phase transformations are discussed in this paper. Furthermore, a tentative Cu-In-Ni ternary phase diagram is proposed to elucidate the progression of Cu/In/Ni interfacial reactions. In addition, series of ternary Cu-In-Ni alloys were designed, fabricated, and heat-treated at 360 °C. And a new ternary compound was found in the Cu-In-Ni 360 oC isothermal section.
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Shih-Kang Lin |
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Shih-Kang Lin Yu-hsiangWang 王郁翔 |
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Yu-hsiangWang 王郁翔 |
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Yu-hsiangWang 王郁翔 Interfacial reactions and phase equilibria between indium thermal interface material and Cu and Ni substrates |
author_sort |
Yu-hsiangWang |
title |
Interfacial reactions and phase equilibria between indium thermal interface material and Cu and Ni substrates |
title_short |
Interfacial reactions and phase equilibria between indium thermal interface material and Cu and Ni substrates |
title_full |
Interfacial reactions and phase equilibria between indium thermal interface material and Cu and Ni substrates |
title_fullStr |
Interfacial reactions and phase equilibria between indium thermal interface material and Cu and Ni substrates |
title_full_unstemmed |
Interfacial reactions and phase equilibria between indium thermal interface material and Cu and Ni substrates |
title_sort |
interfacial reactions and phase equilibria between indium thermal interface material and cu and ni substrates |
publishDate |
2014 |
url |
http://ndltd.ncl.edu.tw/handle/vu8b89 |
work_keys_str_mv |
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