Solder Bonding Behavior in Thermal Compression Non-conductive Paste Process
碩士 === 國立成功大學 === 材料科學及工程學系 === 102 === SUMMARY The present study investigated the bonding behaviors and interfacial reactions in the solder joints of TCNCP (Thermal Compression Non-conductive Paste) process. The bonding behavior was affected by the physical properties of the NCPs. The results show...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/crs497 |