Study of the flow behaviors for molded underfill in flip chip packaging
碩士 === 國立成功大學 === 航空太空工程學系 === 102 === In recent years, the chip of electronic products asks for more and more I/O ports due to the integration of many functions in one single chip. Flip chip process implants solder bumps on the chip surface and those bumps are directly connected to the substrate. D...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98385383291859960879 |