The Effect of Tin Grain Orientations and Grain Boundaries during Current Stressing on Cu6Sn5 Formation
碩士 === 國立交通大學 === 材料科學與工程學系所 === 102 === As electronic devices become more functional and miniaturization, the microelectronic industry is facing a lot of challenges. The fabrication process is encountering many physical limitations. In order to keep up with Moore’s law, the 3D-IC packaging technolo...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80963185072561693058 |