Study of Failure Mechanisms in Flip-Chip Solder Joints and Microbumps under Electromigration Using Kelvin Bump Structures and Finite-Element Analysis
博士 === 國立交通大學 === 材料科學與工程學系所 === 102 === In this study, three types of solder bump samples with Kelvin bump structures were employed to monitor non-destructively the evolution of resistance during electromigration (EM) testing. The first type of sample was flip-chip bumps. The bump resistance was fo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25573236318844434993 |