Metallic Grid-structure Coverage by Contact Coating and Vertical Space Charge Limited Transistor

碩士 === 國立交通大學 === 物理研究所 === 102 === Wet-coating process is a high efficiency and low cost technique. It has been widely employed in organic semiconductor device fabrication. The most popular processes are spin coating and dip coating. However, spin coating is limited by the roughness on the substrat...

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Bibliographic Details
Main Authors: Cheng, Yu-Wen, 鄭羽彣
Other Authors: Meng, Hsin-Fei
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/f6v4k7