Process Integration and Development of Advanced 3D IC Key Technologies with Temporary Bonding and Bottom-Up TSV Formation
碩士 === 國立交通大學 === 電子工程學系 電子研究所 === 102 === Cost is the primary issue that limits the commercial mass production of three-dimensional integrated circuit technologies. Therefore, based on the process improvement, a set of advanced technique process flow has been proposed to achieve low cost and high t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/wwwd77 |