Combination of electrical probing and microscope inspection for failure analysis of semiconductor devices
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 102 === This study was focused on failure analysis for custom product with end terminal production return. Because there is only one or two sample from board level return, the priority of this case event is emergent for tracing all the effecting reason. We propo...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/rbr34g |