Effect of dynamic corrosion on dishing behavior in copper chemical mechanical planarization
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 102 === According to copper is with nice electrical conductivity and better ability to reduce electron migration, it has been utilized to replace aluminum as a new generation of conductive material in the semiconductor manufacturing process by reducing the effec...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45129498178906794624 |