Improvement of TFT-LCD Driver IC Bonding Process
碩士 === 國立交通大學 === 平面顯示技術碩士學位學程 === 102 === In this thesis the defects of the TFT-LCD module process were investigated. Applying the anisotropic conductive adhesive (ACF) and glass bonding in the driver IC bonding process utilizes the conductive particles of the ACF driver IC through the gold bumps a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51126209679159556003 |