The Study of Microstructure in Microbumps and the Application of In Situ Synchrotron Radiation X-ray on Advanced Electronic Packaging
博士 === 國立中央大學 === 化學工程與材料工程學系 === 102 === Due to the demand for high performance and slim volume chips, 3D packaging has great potential over the coming decade. Micro-joints are a crucial element in manufacturing multi-function devices. The reduction in the dimensions of devices has led to a 1000-fo...
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| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45944271695824506189 |