Ferromagnetic Silver Gel Preparation for Through-Silicon Via Filling Process
碩士 === 國立彰化師範大學 === 機電工程學系 === 102 === This paper demonstrates a novel magnetic induced injection method of ferromagnetic composite to build electrically conductive through-silicon vias (TSVs). The through conductive via is filled with conductive ferromagnetic composite by attractive magnetic force....
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62085467633139504366 |