Surface Mount Technology-Optimization Process Condition of Flip Chip Soldering on Flexible Printed Circuit Board
碩士 === 國立高雄海洋科技大學 === 微電子工程研究所 === 102 === Recently, the electronic products are changing constantly, in response to consumer demand, related electronic products are toward miniaturization development, the assembly technology also refined, especially key is on Surface Mount Technology (SMT) . This...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/nf353w |